J.K.Briese, H.Schefer, L.Radomsky, R. Keilmann, R. Mallwitz, "Enhancing Power-Dense and Reliability-Oriented Heat Sink Structures through Additive Manufacturing for Power Electronics in Aviation Applications", The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2025, 27 - 30 May 2025, Dallas, Texas, USA, 2025.