The lecture Electronic Packaging and Interconnection Technology (Aufbau- und Verbindungstechnik in der Elektronik) is offered jointly with Prof. Dr. rer. nat. Erwin Peiner (Institute of Semiconductor Technology). It presents the development of assembly technology from chassis with discrete components and free wiring to printed circuit boards with several conductor layers and surface mount technology.
Requirements on heat conduction and the effects of thermomechanical stress are treated in detail. The substrate materials and joining techniques that are particularly important for power semiconductor modules, such as soldering, adhesive bonding, wire bonding, alloying, direct copper bonding and pressure sintering of silver powder, are covered individually.
Students know the essential technologies for mounting, contacting and packaging microelectronic devices, can evaluate assembly concepts with respect to thermal and mechanical requirements and can select suitable joining techniques for an application.