| City | Period | Online or in presence | Application deadline |
|---|---|---|---|
| Sendai | 09 July - 24 July 2026 | in presence | 15 April 2026 |
The Tohoku University Engineering Summer Program (TESP) is a 16-day international program that brings together engineering students from around the world. Conducted entirely in English, it features lectures and hands-on activities on advanced engineering topics, along with cultural experiences that deepen participants’ understanding of Japan. Each summer, around 50 students gather on the Aobayama Campus to learn, collaborate, and create lasting memories.
(Text: Tohoku University)
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