Contents: Development of electronic assembly from discrete devices and free wire connections to multi-layer printed-circuit-boards and surface mount technology is presented. The requirements for heat dissipation and the effects of thermomechanical stress are thoroughly explained. The state of the art especially concerning power modules is treated in detail for mostly used substrate materials and the joining techniques like soldering, glueing, wire-bonding, alloying, direct-copper bonding and pressure-sintering of silver powder.
Examination: oral
Lecture notes: Copies of the transparancies will be provided during the lecture.
Will be held: each SS
Contact person: apl. Prof. Dr. rer. nat. E. Peiner / N. N.