| City | Period | Online or in presence | Application deadline |
|---|---|---|---|
| Sendai | 03 December - 18 December 2026 | in presence | 24 September 2026 |
Tohoku University Engineering Short Program (TESP) Winter 2026 is an intensive international program that combines research experience in Tohoku University laboratories with entrepreneurship-oriented, project-based learning. Participants work in multicultural teams to explore real-world social challenges, develop value propositions, consider implementation pathways, and connect specialized knowledge gained through laboratory activities to possible solutions for society.
The program also includes field trips, Japanese cultural experiences, and opportunities to interact with Tohoku University students. Through these activities, TESP aims to foster engineers and deep-tech talent who can work across disciplines and cultures and translate research-based knowledge into social value.
TESP Winter 2026 is organized by the School of Engineering, Tohoku University, with cooperation from the International Research Institute of Disaster Science and the Semiconductor Creativity Hub.
(Text: Tohoku University)
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